BGA PCBs, once soldered, must pass a RX inspection. In Tef we have a latest generation Phoenix machine for 3D inspection.

This allows us to process all the internal production of the PCBs as well as contribute to the external service of verification, including the submission of all the photos taken to the customer, who will get details about soldering, voids, etc.

We perform also visual inspections in the previous steps of the process:

  • SPI inspection: after PCB serigraphy and 3D inspection.
  • AOI inspection: of the components, once placed on the PCB. 3D inspection.

For these inspection, we rely on a Pemtron 8800 HSL en 3D.